TY  - CONF
AU  - Thomas Siewert
AU  - Juan Madeni
AU  - S Liu
C2  - Proceedings of the APEX Conference on Electronics Manufacturing
DA  - 2003-06-16
LA  - en
PB  - Proceedings of the APEX Conference on Electronics Manufacturing
PY  - 2003
TI  - Formation and Growth of Intermetallics at the Interface Between Lead-Free Solders and Copper Substrates
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851326
ER  -