TY  - CONF
AU  - Richard Allen
AU  - Urmi Ray
AU  - Vidhya Ramachandran
AU  - Iqbal Ali
AU  - David Read
AU  - Andreas Fehk¿hrer
AU  - J¿rgen Burggraf
C2  - International Wafer-Level Packaging Conference, San Jose, CA
DA  - 2012-11-07
LA  - en
PB  - International Wafer-Level Packaging Conference, San Jose, CA
PY  - 2012
TI  - EVALUATING METHODS OF SHIPPING THIN SILICON WAFERS FOR 3D STACKED APPLICATIONS
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=912462
ER  -