TY  - JOUR
AU  - Brian Grummel
AU  - Habib Mustain
AU  - Z. Shen
AU  - Allen Hefner
C2  - IEEE Transactions on Components Packaging and Manufacturing Technology
DA  - 2013-04-09
LA  - en
M1  - PP
PB  - IEEE Transactions on Components Packaging and Manufacturing Technology
PY  - 2013
TI  - Thermo-Mechanical Characterization of Au–In Transient Liquid Phase Bonding Die-Attach
ER  -