TY - JOUR AU - Chukwudi Okoro AU - Pavel Kabos AU - Jan Obrzut AU - Klaus Hummler AU - Yaw Obeng C2 - IEEE Transactions on Electron Devices DA - 2013-06-01 DO - https://doi.org/10.1109/TED.2013.2257791 LA - en M1 - 60 PB - IEEE Transactions on Electron Devices PY - 2013 TI - Accelerated Stress Test Assessment of Through-Silicon Vias Using RF Signals ER -