TY  - JOUR
AU  - Trevor Braun
AU  - Daniel Josell
AU  - Thomas Moffat
AU  - Jimmy John
C2  - Journal of the Electrochemical Society
DA  - 2019-10-01
LA  - en
M1  - 167
PB  - Journal of the Electrochemical Society
PY  - 2019
TI  - Simulation of Copper Electrodeposition in Through-Hole Vias
ER  -