TY  - JOUR
AU  - Dylan Williams
C2  - IEEE Transactions on Components Packaging and Manufacturing Technology Part B-Advanced Packaging
DA  - 1997-05-01
DO  - https://doi.org/10.1109/96.575563
LA  - en
M1  - 20
PB  - IEEE Transactions on Components Packaging and Manufacturing Technology Part B-Advanced Packaging
PY  - 1997
TI  - Multiconductor Transmission Line Characterization
ER  -