TY - CONF AU - John Moreland C2 - Proceedings of the MEMS & Microsystems Topical Workshop, 6th International Conference & Exhibition on Device Packaging, Scottsdale, AZ, Scottsdale, AZ DA - 2010-01-01 DO - https://doi.org/10.4071/2010DPC-wp23 LA - en M1 - 2010 PB - Proceedings of the MEMS & Microsystems Topical Workshop, 6th International Conference & Exhibition on Device Packaging, Scottsdale, AZ, Scottsdale, AZ PY - 2010 TI - Design of a MEMS force sensor for quantitative measurement in the nano- to piconewton range ER -