TY  - CONF
AU  - Jan Obrzut
AU  - M Jimarez
C2  - Proceedings of the International Conference on Electronic Assembly, Atlanta, GA
DA  - 1998-06-02
LA  - en
PB  - Proceedings of the International Conference on Electronic Assembly, Atlanta, GA
PY  - 1998
TI  - Plastic Flip-Chip-BGA Carrier With Microvias for Chip Scale Packaging
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852844
ER  -