TY  - CONF
AU  - Elizabeth Drexler
C2  - Electronics Components and Technology Conference | 50th | | IEEE
DA  - 2000-05-01
LA  - en
PB  - Electronics Components and Technology Conference | 50th | | IEEE
PY  - 2000
TI  - Thermally Induced Deformations in a Flip-Chip HDI Substrate
ER  -