TY  - JOUR
AU  - Chukwudi Okoro
AU  - Lyle Levine
AU  - Yaw Obeng
AU  - Klaus
AU  - Ruqing Xu
C2  - IEEE Transactions on Electron Devices
DA  - 2014-07-01
LA  - en
M1  - 61
PB  - IEEE Transactions on Electron Devices
PY  - 2014
TI  - Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915348
ER  -