TY  - CONF
AU  - Stan, Gheorghe
AU  - Alderete, Nicolas
AU  - Ciobanu, Cristian Victor
AU  - Daharwal, Paresh
C2  - Wafer-Level Packaging Symposium, SMTA, February 17-19, 2026, San Francisco, CA, USA, San Francisco, CA, US
DA  - 2026-02-17 05:02:00
LA  - en
PB  - Wafer-Level Packaging Symposium, SMTA, February 17-19, 2026, San Francisco, CA, USA, San Francisco, CA, US
PY  - 2026
TI  - ATOMIC FORCE MICROSCOPY-BASED MODES FOR NANOSCALE ELASTIC-PLASTIC CHARACTERIZATION OF MATERIALS USED IN HYBRID BONDING
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961447
ER  -