TY  - CONF
AU  - Stan, Gheorghe
AU  - Gerbig, Yvonne
AU  - Alderete, Nicolas
AU  - Daharwal, Paresh
AU  - Ciobanu, Cristian Victor
C2  - The 2026 IEEE 76th Electronic Components and Technology Conference, Orlando, FL, US
DA  - 2026-06-17 04:06:00
DO  - https://doi.org/10.1109/ECTC51846.2026.00127
LA  - en
PB  - The 2026 IEEE 76th Electronic Components and Technology Conference, Orlando, FL, US
PY  - 2026
TI  - Multiscale Mechanical Characterization of Hybrid-Bonding Copper: From Instrumented Indentation to AFM
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961486
ER  -