TY  - JOUR
AU  - Stan, Gheorghe
AU  - Ciobanu, Cristian Victor
C2  - Materials Letters
DA  - 2025-09-01 04:09:00
DO  - https://doi.org/10.1016/j.matlet.2025.138578
LA  - en
PB  - Materials Letters
PY  - 2025
TI  - Perspective on high-entropy alloys and high-entropy nitrides as diffusion barriers for copper metallization
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959607
ER  -