TY  - CONF
AU  - Centellas, Polette
AU  - Tao, Ran
AU  - Korovich, Andrew
AU  - Landauer, Alexander
AU  - Forster, Amanda
AU  - Iavarone-Garza, Siena
AU  - Ribeiro, Dante
AU  - Nguyen, Huong Giang
AU  - Obrzut, Jan
AU  - Romberg, Stian
AU  - Soles, Christopher
C2  - 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, US
DA  - 2026-05-26 04:05:00
DO  - https://doi.org/10.1109/ECTC51846.2026.00275
LA  - en
PB  - 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, US
PY  - 2026
TI  - Controlling the Reaction Pathway to Tune Packaging Epoxy Properties
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961676
ER  -