TY  - JOUR
AU  - Landauer, Alexander
C2  - 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
DA  - 2026-06-17 04:06:00
DO  - https://doi.org/10.1109/ECTC51846.2026.00309
LA  - en
PB  - 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
PY  - 2026
TI  - A digital image correlation-based research platform for cure shrinkage and thermal expansion measurements on epoxy test materials
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=961654
ER  -