TY  - HEAR
AU  - Bau, Mariona Coll
AU  - Gergel-Hackett, Nadine
AU  - Jurchescu, Oana
AU  - Richter, Curt
AU  - Hacker, Christina
DA  - 2010-06-04 00:06:00
LA  - en
PY  - 2010
TI  - Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device
ER  -