TY  - JOUR
AU  - Cheung, Kin
AU  - Wen, Yu Xin
AU  - Tsui, Bing-Yue
C2  - IEEE Transactions on Device and Materials Reliability
DA  - 2025-11-21 05:11:00
DO  - https://doi.org/10.1109/TDMR.2025.3635880
LA  - en
M1  - 26
PB  - IEEE Transactions on Device and Materials Reliability
PY  - 2025
TI  - On the Response Time Constant of Interface Defects in Accumulation
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=958872
ER  -