TY - JOUR AU - Braun, Trevor AU - Josell, Daniel AU - Moffat, Thomas C2 - Electrochimica Acta DA - 2021-02-15 05:02:00 LA - en PB - Electrochimica Acta PY - 2021 TI - Simulating Cu Electrodeposition in High Aspect Ratio Features: Effect of Control Mode and Uncompensated Resistance in S-NDR Systems UR - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=931716 ER -