TY  - JOUR
AU  - Tao, Ran
AU  - Centellas, Polette
AU  - Romberg, Stian
AU  - Kotula, Anthony
AU  - Holmes, Gale
AU  - Forster, Amanda
AU  - Soles, Christopher
AU  - Allen, Bob
AU  - Cetegen, Edvin
AU  - Chen, William
AU  - Gotro, Jeff
AU  - Poliks, Mark
C2  - IEEE Transactions on Components, Packaging and Manufacturing Technology
DA  - 2025-08-27 04:08:00
DO  - https://doi.org/10.1109/TCPMT.2025.3603484
LA  - en
PB  - IEEE Transactions on Components, Packaging and Manufacturing Technology
PY  - 2025
TI  - Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959970
ER  -