TY  - ICOMM
AU  - Tao, Ran
AU  - Chan, Benson
AU  - Vardaman, Jan
C1  - https://eps.ieee.org/publications/enews/august-2024/1193-2024-ectc-special-session-report-advancing-metrology-for-next-generation-microelectronics.html
C2  - IEEE Electronics Packaging Society
DA  - 2024-07-31 04:07:00
LA  - en
PB  - IEEE Electronics Packaging Society
PY  - 2024
TI  - 2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=958598
ER  -