TY  - GEN
AU  - Kessler, H K
C2  - , National Institute of Standards and Technology, Gaithersburg, MD
DA  - 1973-01-01 05:01:00
DO  - https://doi.org/10.6028/NBS.TN.767
LA  - en
PB  - , National Institute of Standards and Technology, Gaithersburg, MD
PY  - 1973
TI  - Microelectronic interconnection bonding with ribbon wire:
ER  -