TY  - JOUR
AU  - Eric Vogel
AU  - Monica Edelstein
AU  - John Suehle
C2  - Microelectronic Engineering
DA  - 2001-11-01
LA  - en
PB  - Microelectronic Engineering
PY  - 2001
TI  - Reliability of Ultra-Thin Silicon Dioxide Under Substrate Hot-Electronic, Substrate Hot-Hole, and Tunneling Stress
ER  -