TY  - CONF
AU  - Jan Obrzut
C2  - IMAPS International Advanced Technology Workshop on Flip Chip Technology, Braselton, GA
DA  - 1999-05-03
LA  - en
PB  - IMAPS International Advanced Technology Workshop on Flip Chip Technology, Braselton, GA
PY  - 1999
TI  - Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851554
ER  -