@article{931031,
  author = {Trevor Braun and Daniel Josell and Thomas P. Moffat},
  title = {Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias},
  year = {2020},
  month = {2020-12-16 05:12:00},
  publisher = {Journal of the Electrochemical Society},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=930972},
  language = {en},
}