@article{925596,
  author = {Daniel Josell and Trevor Braun and Thomas P. Moffat},
  title = {Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias},
  year = {2022},
  number = {169},
  month = {2022-03-17 04:03:00},
  publisher = {Journal of the Electrochemical Society},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=934099},
  doi = {https://doi.org/10.1149/1945-7111/ac5ad8},
  language = {en},
}