@article{925591,
  author = {Daniel Josell and Thomas P. Moffat and Trevor Braun},
  title = {Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias},
  year = {2021},
  number = {168},
  month = {2021-11-02 04:11:00},
  publisher = {Journal of the Electrochemical Society},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=933139},
  doi = {https://doi.org/10.1149/1945-7111/ac2bea},
  language = {en},
}