@conference{868656,
  author = {Richard Allen and David Read and Victor Vartanian and Winthrop Baylies and William Kerr and Mark Plemmons and Kevin Turner},
  title = {A ROUND ROBIN EXPERIMENT TO SUPPORT BOND VOID MEASUREMENT STANDARDS},
  year = {2016},
  month = {2016-05-01 04:05:00},
  publisher = {Conference on Wafer Bonding for Microsystems 3S- and Wafer Level Integration, Braunschweig, DE},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=919791},
  language = {en},
}