@article{836776,
  author = {S Allen and M Notis and R Chromik and Richard Vinci and D Lewis and Robert Schaefer},
  title = {Microstructural Evolution in Lead-Free Solder Alloy. Part II: Directionally Solidified Eutectic Tin-Silver-Copper, Tin-Copper and Tin-Silver Alloys.},
  year = {2021},
  month = {2021-10-12 15:10:19},
  publisher = {Journal of Materials Research},
  language = {en},
}