@conference{830386,
  author = {Ryan Birringer and Roey Shaviv and Thomas Mountsier and Jon Reid and Jian Zhou and Roy Geiss and David Read and Reinhold Dauskardt},
  title = {Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films},
  year = {2009},
  month = {2009-10-13 00:10:00},
  publisher = {Advanced Metallization Conference Proceedings 2009, Baltimore, MD, US},
  language = {en},
}