@article{829116,
  author = {Chukwudi Okoro and Yaw Obeng},
  title = {A Case Study on the Impact of Local Material Chemistry on the Mechanical Reliability of Packaged Integrated Circuits: Correlation of the Packaging Fallout to the Chemistry of Passivation Dielectrics in an Al-Cu System},
  year = {2012},
  month = {2012-03-19 00:03:00},
  publisher = {Microelectronics Reliability},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=909379},
  language = {en},
}