@article{806406,
  author = {Ryan Birringer and Roey Shaviv and Roy Geiss and David Read and Reinhold Dauskardt},
  title = {Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper/dielectric diffusion barrier films},
  year = {2011},
  number = {110},
  month = {2011-08-15 00:08:00},
  publisher = {Microelectronic Engineering},
  doi = {https://doi.org/10.1063/1.3624659},
  language = {en},
}