@article{803976,
  author = {S Pyo and S Kim and Daniel Wheeler and Thomas Moffat and Daniel Josell},
  title = {Seam-Free Fabrication of Sub-Micrometer Copper Interconnects by Iodine-Catalyzed Chemical Vapor Deposition},
  year = {2003},
  number = {93 No. 2},
  month = {2003-01-01 00:01:00},
  publisher = {Journal of Applied Physics},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853178},
  language = {en},
}