@conference{802101,
  author = {Christopher Sunday and Dmitry Veksler and Kin Cheung and Yaw Obeng},
  title = {Understanding the Pre-Failure Thermo-Mechanical Issues In Electromigration of TSV Enabled 3D ICs},
  year = {2017},
  number = {77},
  month = {2017-05-30 00:05:00},
  publisher = {ECS Transactions Vol 76, 2017: Dielectrics for Nanosystems 8: Materials Science, Processing, 
Reliability, and 
Manufacturing -and- Solid State Topics, New orleans, LA, US},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=922466},
  doi = {https://doi.org/10.1149/07702.0071ecst},
  language = {en},
}