@conference{783006,
  author = {Juan Madeni and S Liu and Thomas Siewert},
  title = {Intermetallics Formation and Growth at the Interface of Tin-Based Solder Alloys and Copper Substrates},
  year = {2003},
  month = {2003-02-17 00:02:00},
  publisher = {Brazing and Soldering Conference, Undefined},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851327},
  language = {en},
}