@conference{763391,
  author = {J Rodriguez and John Reichl and Zharadeen Parrilla and Allen Hefner Jr. and David Berning and M Velez-Reyes and Jih-Sheng Lai},
  title = {Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules},
  year = {2002},
  month = {2002-10-24 00:10:00},
  publisher = {Proc., 2002 IEEE Industry Application Society, Pittsburgh, PA, USA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=30113},
  language = {en},
}