@conference{60711,
  author = {Thomas Siewert and Juan Madeni and S Liu},
  title = {Formation and Growth of Intermetallics at the Interface Between Lead-Free Solders and Copper Substrates},
  year = {2003},
  month = {2003-06-16},
  publisher = {Proceedings of the APEX Conference on Electronics Manufacturing},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851326},
  language = {en},
}