@conference{42441,
  author = {Richard Allen and Andrew Rudack and David Read and Winthrop Baylies},
  title = {Intercomparison of Methods for Detecting and Characterizing Voids in Bonded Wafer Pairs},
  year = {2010},
  month = {2010-10-01},
  publisher = {Semiconductor Wafer Bonding 11: Science, Technology, and Applications, Las Vegas, NV},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=906152},
  language = {en},
}