@conference{41656,
  author = {Brian Grummel and Habib Mustain and Z. Shen and Allen Hefner},
  title = {Reliability Study of Au-In Transient Liquid Phase Bonding for SiC Power Semiconductor Devices},
  year = {2011},
  month = {2011-05-24},
  publisher = {Power Semiconductor Devices & IC's (ISPSD), 2011 23nd International Symposium on, San Diego, CA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=908130},
  language = {en},
}