@conference{37246,
  author = {Ravikiran Attota and Andrew Rudack},
  title = {Dimensional Analysis of Through Silicon Vias Using the TSOM Method},
  year = {2011},
  month = {2011-07-12},
  publisher = {SEMATECH Workshop on 3D Interconnect Metrology, San Francisco, CA},
  language = {en},
}