@conference{28786,
  author = {Richard Allen and Urmi Ray and Vidhya Ramachandran and Iqbal Ali and David Read and Andreas Fehk¿hrer and J¿rgen Burggraf},
  title = {EVALUATING METHODS OF SHIPPING THIN SILICON WAFERS FOR 3D STACKED APPLICATIONS},
  year = {2012},
  month = {2012-11-07},
  publisher = {International Wafer-Level Packaging Conference, San Jose, CA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=912462},
  language = {en},
}