@article{252681,
  author = {Thomas Moffat and Daniel Josell},
  title = {Bottom-up Cu Filling of Annular Through Silicon Vias: Microstructure and Texture},
  year = {2020},
  month = {2020-01-06},
  publisher = {Electrochimica ACTA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=929047},
  language = {en},
}