@article{252576,
  author = {Daniel Josell and Thomas Moffat and L Menk and E Baca and M Blain and A Smith and Jason Dominguez and J McClain and P Yeh and A Hollowell},
  title = {Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology},
  year = {2018},
  month = {2018-11-02},
  publisher = {Journal of the Electrochemical Society},
  language = {en},
}