@article{252571,
  author = {Daniel Josell and Thomas Moffat and Lyle Menk and Andrew Hollowell and M Blain},
  title = {Bottom-up Copper Filling of Millimeter Size Through Silicon Vias},
  year = {2019},
  month = {2019-01-12},
  publisher = {Journal of the Electrochemical Society},
  language = {en},
}