@article{251386,
  author = {Trevor Braun and Daniel Josell and Thomas Moffat and Jimmy John},
  title = {Simulation of Copper Electrodeposition in Through-Hole Vias},
  year = {2019},
  number = {167},
  month = {2019-10-01},
  publisher = {Journal of the Electrochemical Society},
  language = {en},
}