@conference{232226,
  author = {Chukwudi Okoro and Yaw Obeng},
  title = {Effect of Thermal Cycling on the Signal Integrity and Morphology of TSV Isolation Liner-SiO2},
  year = {2012},
  month = {2012-07-30},
  publisher = {2012 IEEE International Interconnect Technology Conference - IITC, San Jose, CA},
  doi = {https://doi.org/10.1109/IITC.2012.6251582},
  language = {en},
}