@article{21676,
  author = {Chukwudi Okoro and June Lau and Yaw Obeng and Klaus Hummler},
  title = {A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability},
  year = {2014},
  number = {61},
  month = {2014-01-01},
  publisher = {IEEE Transactions on Electron Devices},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=913115},
  language = {en},
}