@article{168976,
  author = {Soo Kim and Daniel Josell and Thomas Moffat},
  title = {Electrodeposition of Copper in the PE-PEG-C1-SPS Additive System Reduction of Overfill Bump Formation During Cu Superfilling},
  year = {2006},
  number = {153},
  month = {2006-07-05},
  publisher = {Journal of the Electrochemical Society},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853408},
  language = {en},
}