@article{168756,
  author = {Thomas Moffat and Marlon Walker and P Chen and John Bonevich and William Egelhoff and Lee Richter and Daniel Josell and C Witt and T Aaltonen and M Ritala and M Leskela},
  title = {Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing},
  year = {2005},
  number = {153},
  month = {2005-12-02},
  publisher = {Journal of the Electrochemical Society},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853400},
  language = {en},
}