@conference{167221,
  author = {Jan Obrzut and M Jimarez},
  title = {Plastic Flip-Chip-BGA Carrier With Microvias for Chip Scale Packaging},
  year = {1998},
  month = {1998-06-02},
  publisher = {Proceedings of the International Conference on Electronic Assembly, Atlanta, GA},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852844},
  language = {en},
}