@article{15641,
  author = {Chukwudi Okoro and Lyle Levine and Yaw Obeng and Klaus and Ruqing Xu},
  title = {Non-destructive Measurement of the Residual Stresses in Copper Through-Silicon Vias using Synchrotron Based Micro-beam X-ray Diffraction},
  year = {2014},
  number = {61},
  month = {2014-07-01},
  publisher = {IEEE Transactions on Electron Devices},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=915348},
  language = {en},
}